KEMET flat lapping machine on floor

Ground plane lapping and polishing machines are available in platen sizes from 24" to 120", i.e. diameters from 610 mm to 3 meters.

Planar lapping machines are generally used with conditioning or correction rings (self-lapping rings). These rings move over the surface of the lapping or polishing platen and rotate the parts to be lapped. Chamfers on their outer edges help impregnate the lapping plate with diamond abrasive. The rings can also be used to help control the flatness of the honing plate. The standard number of conditioning rings used is three, but four rings are common on some larger machines. For special applications, specific ring sizes can be used.